LICENSE.txt

SOLDERPAD HARDWARE LICENSE VERSION 2.1

This license operates as a wraparound license to the Apache License Version 2.0
(the "Apache License") and incorporates the terms and conditions of the Apache
License (which can be found here: http://apache.org/licenses/LICENSE-2.0), with
the following additions and modifications. It must be read in conjunction with
the Apache License. Section 1 below modifies definitions and terminology in the
Apache License and Section 2 below replaces Section 2 of the Apache License.
The Appendix replaces the Appendix in the Apache License. You may, at your
option, choose to treat any Work released under this license as released under
the Apache License (thus ignoring all sections written below entirely).

    1. Terminology in the Apache License is supplemented or modified as
    follows:

    "Authorship": any reference to 'authorship' shall be taken to read
    "authorship or design".

    "Copyright owner": any reference to 'copyright owner' shall be taken to
    read "Rights owner".

    "Copyright statement": the reference to 'copyright statement' shall be
    taken to read 'copyright or other statement pertaining to Rights'

    The following new definition shall be added to the Definitions section of
    the Apache License:

    "Rights" means copyright and any similar right including design right
    (whether registered or unregistered), rights in semiconductor topographies
    (mask works) and database rights (but excluding Patents and Trademarks).

    The following definitions shall replace the corresponding definitions in
    the Apache License:

    "License" shall mean this Solderpad Hardware License version 2.1, being the
    terms and conditions for use, manufacture, instantiation, adaptation,
    reproduction, and distribution as defined by Sections 1 through 9 of this
    document.

    "Licensor" shall mean the Rights owner or entity authorized by the Rights
    owner that is granting the License.

    "Derivative Works" shall mean any work, whether in Source or Object form,
    that is based on (or derived from) the Work and for which the editorial
    revisions, annotations, elaborations, or other modifications represent, as
    a whole, an original work of authorship or design. For the purposes of this
    License, Derivative Works shall not include works that remain reversibly
    separable from, or merely link (or bind by name) or physically connect to
    or interoperate with the Work and Derivative Works thereof.

    "Object" form shall mean any form resulting from mechanical transformation
    or translation of a Source form or the application of a Source form to
    physical material, including but not limited to compiled object code,
    generated documentation, the instantiation of a hardware design or physical
    object or material and conversions to other media types, including
    intermediate forms such as bytecodes, FPGA bitstreams, moulds, artwork and
    semiconductor topographies (mask works).

    "Source" form shall mean the preferred form for making modifications,
    including but not limited to source code, net lists, board layouts, CAD
    files, documentation source, and configuration files.

    "Work" shall mean the work of authorship or design, whether in Source or
    Object form, made available under the License, as indicated by a notice
    relating to Rights that is included in or attached to the work (an example
    is provided in the Appendix below).

    2. Grant of License. Subject to the terms and conditions of this License,
    each Contributor hereby grants to You a perpetual, worldwide,
    non-exclusive, no-charge, royalty-free, irrevocable license under the
    Rights to reproduce, prepare Derivative Works of, make, adapt, repair,
    publicly display, publicly perform, sublicense, and distribute the Work and
    such Derivative Works in Source or Object form and do anything in relation
    to the Work as if the Rights did not exist.

APPENDIX

Copyright 2022 TU Wien
SPDX-License-Identifier: Apache-2.0 WITH SHL-2.1

Licensed under the Solderpad Hardware License v 2.1 (the "License"); you may
not use this file except in compliance with the License, or, at your option,
the Apache License version 2.0. You may obtain a copy of the License at

https://solderpad.org/licenses/SHL-2.1/

Unless required by applicable law or agreed to in writing, any work distributed
under the License is distributed on an "AS IS" BASIS, WITHOUT WARRANTIES OR
CONDITIONS OF ANY KIND, either express or implied. See the License for the
specific language governing permissions and limitations under the License.